The **ATS-01G-03-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components like BGA (Ball Grid Array) chips, CPUs, and GPUs in space-constrained environments. --- ### 1. Technical Specifications Below are the primary physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 26.22 °C/W (Unducted Flow @ 200 LFM) | | **Dimensions** | 40mm x 40mm x 9mm | | **Pressure Spring** | Brass / High-Performance | | **Compliance** | RoHS Compliant | --- ### 2. Key Design Elements #### A. Fin Geometry (Straight Fin) The "01G" series typically utilizes a straight-fin design. This is optimized for **unidirectional airflow**. The vertical fins allow air to pass through the length of the sink, efficiently stripping heat from the surface area. #### B. Push-Pin Attachment System The part number suffix indicates the mounting hardware: * **Secure Fit:** Uses a spring-loaded push-pin mechanism. * **Reliability:** Provides consistent pressure on the component to maximize thermal interface material (TIM) performance. * **Hole Pattern:** Requires pre-drilled holes on the PCB (typically 3.0mm diameter). #### C. Thermal Interface Material (TIM) The **C2** in the part number indicates that the heat sink comes pre-applied with **T766 Phase Change Material**. This is superior to standard thermal grease as it melts at operating temperatures to fill microscopic air gaps between the chip and the heat sink. --- ### 3. Thermal Performance Profile The effectiveness of the ATS-01G-03-C2-R0 depends heavily on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 26.22 | | 400 | 12.60 | | 600 | 8.35 | | 800 | 6.55 | --- ### 4. Applications * **Network Switches/Routers:** For cooling high-speed processing chips. * **Embedded Systems:** Where low-profile (9mm height) cooling is required. * **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators.