The **ATS-01G-10-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series, designed specifically for cooling electronic components such as processors, chipsets, and GPUs. ### 1. Technical Specifications The following table summarizes the core electronic and mechanical properties of the part: | Property | Value / Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (Body) / Copper (optional base) | | **Thermal Resistance** | 7.89°C/W @ 100 LFM | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 25.00mm | | **Attachment Method** | Push-pin (Brass/Plastic) | | **Surface Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Functional Electronic Components The "electronic" nature of this part is passive, but its design is critical for the survival of active electronics. #### A. Thermal Management (Thermal Resistance) The primary function is to dissipate heat generated by semiconductors. The performance varies based on airflow (measured in Linear Feet per Minute - LFM): * **Unducted Flow:** 7.89°C/W @ 100 LFM. * **Ducted Flow:** 1.47°C/W @ 500 LFM. Lower resistance values indicate more efficient heat transfer from the silicon die to the ambient air. #### B. Push-pin Attachment System This part utilizes a spring-loaded push-pin system. This is crucial for: 1. **Uniform Pressure:** Ensures the heat sink makes consistent contact with the electronic component. 2. **Vibration Resistance:** Securely holds the heat sink in place during industrial or automotive vibration. 3. **Tool-free Installation:** Allows for rapid assembly in manufacturing environments. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a high-performance phase-change or grease-like material that fills microscopic air gaps between the heat sink and the electronic component (CPU/IC), significantly reducing contact resistance. --- ### 3. Applications This specific model is commonly used in: * **Telecommunications:** Cooling FPGA and ASIC chips. * **Power Supplies:** Dissipating heat from high-wattage transistors. * **Embedded Systems:** Industrial PCs and automation controllers. ---