The **ATS-01G-129-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is a passive electronic cooling component designed to dissipate heat from integrated circuits (ICs) and other heat-generating electronic parts. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific model: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 1.35°C/W (at 200 LFM / 1.0 m/s) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Components and Design Features #### A. Fin Design The "129" series utilizes a **straight-fin** or **cross-cut** design depending on the specific sub-configuration. This model is optimized for **forced air cooling** (where a fan is present). The fin density is calculated to maximize surface area while maintaining a low pressure drop. #### B. Push-Pin Attachment Mechanism This part features the ATS **pushPIN™** system, which consists of: * **Brass/Plastic Pins:** Used to secure the heat sink to the PCB. * **Compression Springs:** Provides precise, uniform pressure (load) on the component to ensure maximum heat transfer. * **Compatibility:** Pre-drilled holes in the PCB are required for mounting. #### C. Thermal Interface Material (TIM) The base of the heat sink comes pre-applied with **ATS T766**, a high-performance thermal grease. This eliminates the need for manual application and ensures there are no air gaps between the heat sink and the electronic chip (e.g., CPU, FPGA, or GPU). --- ### 3. Part Number Breakdown (Nomenclature) To understand the variations, here is how the part number is structured: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **01:** General product series. * **G:** Push-pin attachment type. * **129:** Specific footprint and fin geometry. * **C2:** Material/Performance grade (Aluminum with specific thermal properties). * **R0:** Revision/Packaging code. --- ### 4. Typical Applications This heat sink is commonly used in industrial and high-reliability electronics, including: * **Telecommunications:** Cooling of networking switches and routers. * **Power Supplies:** Managing heat in high-efficiency DC-DC converters. * **Embedded Systems:** Cooling microprocessors in automated machinery.