ATS-01G-142-C2-R0
AI

The **ATS-01G-142-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS).
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### 1. Technical Specifications
The following table highlights the core physical and thermal characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Dimensions (L x W)** | 30.00 mm x 30.00 mm |
| **Height (Off Base)** | 15.00 mm |
| **Thermal Resistance** | 10.07° C/W (@ 100 LFM) |
| **Flow Configuration** | Cross-Cut (Straight Fin) |
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### 2. Design and Engineering Features
#### A. pushPIN™ Attachment System
The "01G" and "R0" designations often refer to the specific mounting hardware. This system uses a spring-loaded push-pin mechanism which provides:
* **Consistent Pressure:** Ensures optimal contact between the heat sink and the electronic component (CPU, GPU, or FPGA).
* **Easy Installation:** Requires pre-drilled holes in the PCB, allowing for quick assembly without adhesives.
#### B. Thermal Performance
The heat sink is designed for **forced air cooling** (convection).
* **Low Flow (100 LFM):** 10.07° C/W.
* **High Flow (700 LFM):** 3.17° C/W.
As airspeed increases, the efficiency of the heat dissipation improves significantly, making it ideal for high-density server environments.
#### C. Cross-Cut Fin Pattern
Unlike simple straight fins, the cross-cut design allows for:
1. **Omnidirectional Airflow:** It can accept air from multiple directions, which is useful if the fan orientation isn't perfectly aligned.
2. **Increased Surface Area:** Maximizes the area available for heat transfer within a compact 30x30mm footprint.
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### 3. Applications
This part is typically used in the following electronic sectors:
* **Telecommunications:** Cooling small chips on line cards.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.
- ⤷
What are the compatible PCB hole diameters for the push-pin mounting?
- ⤷ How does 'Blue Anodized' finish affect the thermal emissivity of the part?
- ⤷ Can this heat sink be used with a Thermal Interface Material (TIM) pre-applied?