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  • ATS-01G-142-C2-R0

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    The **ATS-01G-142-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height (Off Base)** | 15.00 mm | | **Thermal Resistance** | 10.07° C/W (@ 100 LFM) | | **Flow Configuration** | Cross-Cut (Straight Fin) | --- ### 2. Design and Engineering Features #### A. pushPIN™ Attachment System The "01G" and "R0" designations often refer to the specific mounting hardware. This system uses a spring-loaded push-pin mechanism which provides: * **Consistent Pressure:** Ensures optimal contact between the heat sink and the electronic component (CPU, GPU, or FPGA). * **Easy Installation:** Requires pre-drilled holes in the PCB, allowing for quick assembly without adhesives. #### B. Thermal Performance The heat sink is designed for **forced air cooling** (convection). * **Low Flow (100 LFM):** 10.07° C/W. * **High Flow (700 LFM):** 3.17° C/W. As airspeed increases, the efficiency of the heat dissipation improves significantly, making it ideal for high-density server environments. #### C. Cross-Cut Fin Pattern Unlike simple straight fins, the cross-cut design allows for: 1. **Omnidirectional Airflow:** It can accept air from multiple directions, which is useful if the fan orientation isn't perfectly aligned. 2. **Increased Surface Area:** Maximizes the area available for heat transfer within a compact 30x30mm footprint. --- ### 3. Applications This part is typically used in the following electronic sectors: * **Telecommunications:** Cooling small chips on line cards. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.
    ✨ Follow-up Questions
    • ⤷ What are the compatible PCB hole diameters for the push-pin mounting?
    • ⤷ How does 'Blue Anodized' finish affect the thermal emissivity of the part?
    • ⤷ Can this heat sink be used with a Thermal Interface Material (TIM) pre-applied?