The **ATS-01G-150-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications Below are the key mechanical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-pin (Spring-loaded) | | **Material** | Aluminum (Body) / Blue Anodized (Finish) | | **Thermal Resistance** | 4.82°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height (Fin)** | 25.00mm | | **Pin Pitch** | 40.00mm | --- ### 2. Physical Design and Construction The design of the ATS-01G-150-C2-R0 is optimized for efficiency in airflow: * **Fin Style (Straight Fin):** This model typically features a straight-fin design, which offers low pressure drop and is ideal for systems with a steady direction of airflow (forced convection). * **Material:** It is made of Aluminum, which provides a high thermal conductivity to weight ratio. * **Blue Anodized Finish:** This treatment increases the surface emissivity (improving radiation heat transfer) and protects the aluminum from corrosion. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766**, a high-performance phase-change material that ensures the microscopic gaps between the chip and the heat sink are filled for maximum heat transfer. --- ### 3. Attachment Mechanism: pushPIN™ One of the defining features of this part is its mounting system: 1. **Push-Pins:** These are plastic or metal pins that snap into pre-drilled holes on the PCB. 2. **Compression Springs:** The pins are paired with springs that apply a precise, consistent amount of pressure on the component. This ensures the best possible contact with the heat source without damaging the silicon or the PCB. 3. **Ease of Assembly:** It allows for quick installation and removal during manufacturing or maintenance. --- ### 4. Typical Applications This heat sink is commonly used in: * **Embedded Systems:** For cooling mid-range processors. * **Telecommunications:** Cooling ASICs in networking switches or routers. * **Power Electronics:** Dissipating heat from high-speed voltage regulators.