The **ATS-01G-154-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "push-pin" attachment series designed for efficient thermal management of integrated circuits (ICs). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Type** | Top Mount Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Thermal Resistance (Unducted)** | 2.85°C/W @ 100 LFM | | **Attachment Method** | Push-Pin (Brass, 4.7mm OD) | | **Spring Type** | ATS-PPS-01 | --- ### 2. Design and Construction The "electronic" functionality of this part is passive, focusing on heat dissipation to prevent component failure. * **Fin Profile:** It typically features a **Square-Cut** or **Cross-Cut** fin pattern. This design allows for multidirectional airflow, making it versatile for different system layouts. * **Base Material:** Made from high-grade aluminum to balance weight and thermal conductivity. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** phase-change material or similar, ensuring a low-resistance thermal path between the chip and the heat sink. --- ### 3. Key Components of the Part Number Decoding the "ATS-01G-154-C2-R0" nomenclature helps in understanding its specific features: 1. **ATS-01**: The manufacturer series. 2. **G**: Denotes the specific mounting hole pattern or hardware set. 3. **154**: Internal code for the specific fin geometry and size (40x40x25mm). 4. **C2**: Indicates the material and finish (Aluminum, Blue Anodized). 5. **R0**: Refers to the revision and packaging standard. --- ### 4. Application This heat sink is commonly used on: * **BGA (Ball Grid Array)** components. * **CPUs/GPUs** in embedded systems. * **High-speed telecommunications** hardware where vertical space allows for a 25mm profile.