The **ATS-01G-19-C2-R0** is a specific electronic component categorized as a **Heatsink**, designed by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series and is engineered for high-performance thermal management in electronic assemblies. --- ### 1. Technical Specifications The following table highlights the core technical data for this component: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 9.77°C/W (Unducted Flow @ 100 LFM) | | **Thermal Resistance** | 3.32°C/W (Ducted Flow) | | **Dimensions (L x W)** | 54.00mm x 54.00mm | | **Height (H)** | 20.00mm | | **Pitch** | Fine-Pitch | --- ### 2. Key Components & Features #### A. The Heat Sink Body * **Geometry:** It features a "Fine-Pitch" design. This means it has a high density of fins, providing a larger surface area to dissipate heat into the surrounding air. * **Material:** Constructed from high-quality aluminum for optimal thermal conductivity and lightweight properties. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or thermal tape, this part uses a mechanical attachment system: * **Push Pins:** Durable brass or plastic pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These provide a precise amount of "force" (pressure) to ensure the bottom of the heatsink stays in perfect contact with the electronic chip (CPU/GPU/FPGA). #### C. Thermal Interface Material (TIM) * The part usually comes with a pre-applied **Thermal Interface Material** on the base. This fills microscopic air gaps between the chip and the heatsink to improve heat transfer. --- ### 3. Part Number Breakdown (Nomenclature) To understand variations of this part, here is how the code is structured: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **01G** | Series/Configuration Type | | **19** | Specific size/dimension code | | **C2** | Thermal performance/fin characteristic | | **R0** | RoHS Compliant / Revision code | --- ### 4. Application Use Case This component is typically used in: * **Networking Equipment:** Routers and switches with high-speed processors. * **Industrial PCs:** Where vibration resistance is needed (provided by the mechanical pins). * **Power Supplies:** To cool MOSFETs or other heat-generating semiconductors.