The **ATS-01G-196-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It is designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or power transistors. ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Push-pin Heat Sink (Top Mount) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (with springs) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 6.17°C/W (at 100 LFM) | | **Flow Pattern** | Straight Fin | --- ### Core Electronic & Mechanical Features #### 1. Heat Dissipation Efficiency The "Straight Fin" design provides a high surface area to volume ratio. This allows air to flow through the fins efficiently, reducing the junction temperature of the electronic component it is attached to. #### 2. Mounting Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the **ATS-01G-196-C2-R0** uses a mechanical push-pin system: * **Compression Springs:** These provide a precise amount of downward force, ensuring consistent contact between the heat sink and the chip. * **Pre-drilled Holes:** This part requires specific PCB mounting holes (usually 3.0mm diameter) for secure installation. #### 3. Thermal Interface Material (TIM) This specific model usually comes with **pre-applied Thermal Interface Material (T412)**. This is a phase-change material that fills microscopic air gaps between the heat sink and the component, significantly lowering thermal resistance compared to air. #### 4. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Provides corrosion resistance and slightly improves emissivity for radiant heat transfer. --- ### Application Usage This part is commonly used in industrial and telecommunications electronics where reliability is critical: * **Embedded Systems:** For cooling SoCs (System on Chips). * **Power Supplies:** To manage heat in voltage regulators. * **Network Equipment:** Used on switches and routers to prevent thermal throttling.