ATS-01G-199-C2-R0
AI

The **ATS-01G-199-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **pushPIN™** series, designed specifically for cooling electronic components such as CPUs, GPUs, and other high-power ICs.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 6.00mm |
| **Pitch** | Fine Pitch |
| **Pattern** | Straight Fin |
| **Thermal Resistance** | 15.83 °C/W (@ 100 LFM) |
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### 2. Key Component Features
#### A. Attachment Mechanism: pushPIN™
Unlike standard adhesive-based heat sinks, this model uses a **pushPIN™** system.
* **Engagement:** A flexible pin and spring assembly provides a precise, repeatable pressure on the component.
* **Hardware:** Usually paired with brass or plastic pins and a stainless steel spring for durability.
#### B. Thermal Performance
The "C2" in the part number indicates a specific thermal interface material (TIM) or finish. This heat sink is optimized for high airflow environments.
* **Fine Pitch Fins:** The straight fin design allows for a large surface area in a low-profile (6mm) height, making it ideal for tight enclosures.
* **Low Profile:** At only 6mm tall, it is designed for "1U" or "blade" server applications where vertical space is limited.
#### C. Material and Coating
* **Aluminum 6063:** Provides a balance between thermal conductivity and weight.
* **Blue Anodization:** Not only provides a professional aesthetic but also adds a protective layer against corrosion and slightly improves radiant heat emissivity.
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### 3. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer: Advanced Thermal Solutions |
| **01G** | Series/Internal Identifier |
| **199** | Specific Product Dimension/Design code |
| **C2** | Thermal Interface Material (T766/Phase Change) |
| **R0** | RoHS Compliant / Revision code |
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- ⤷
What are the recommended mounting hole diameters for the pushPIN system?
- ⤷ How does the thermal resistance change at higher airflows (e.g.
- ⤷ 500 LFM)?
- ⤷ Is there a version of this heat sink with a higher profile for better cooling?