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  • ATS-01G-199-C2-R0

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    The **ATS-01G-199-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **pushPIN™** series, designed specifically for cooling electronic components such as CPUs, GPUs, and other high-power ICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 6.00mm | | **Pitch** | Fine Pitch | | **Pattern** | Straight Fin | | **Thermal Resistance** | 15.83 °C/W (@ 100 LFM) | --- ### 2. Key Component Features #### A. Attachment Mechanism: pushPIN™ Unlike standard adhesive-based heat sinks, this model uses a **pushPIN™** system. * **Engagement:** A flexible pin and spring assembly provides a precise, repeatable pressure on the component. * **Hardware:** Usually paired with brass or plastic pins and a stainless steel spring for durability. #### B. Thermal Performance The "C2" in the part number indicates a specific thermal interface material (TIM) or finish. This heat sink is optimized for high airflow environments. * **Fine Pitch Fins:** The straight fin design allows for a large surface area in a low-profile (6mm) height, making it ideal for tight enclosures. * **Low Profile:** At only 6mm tall, it is designed for "1U" or "blade" server applications where vertical space is limited. #### C. Material and Coating * **Aluminum 6063:** Provides a balance between thermal conductivity and weight. * **Blue Anodization:** Not only provides a professional aesthetic but also adds a protective layer against corrosion and slightly improves radiant heat emissivity. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **01G** | Series/Internal Identifier | | **199** | Specific Product Dimension/Design code | | **C2** | Thermal Interface Material (T766/Phase Change) | | **R0** | RoHS Compliant / Revision code | ---
    ✨ Follow-up Questions
    • ⤷ What are the recommended mounting hole diameters for the pushPIN system?
    • ⤷ How does the thermal resistance change at higher airflows (e.g.
    • ⤷ 500 LFM)?
    • ⤷ Is there a version of this heat sink with a higher profile for better cooling?