The **ATS-01G-25-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other electronic surface-mount components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 60 mm x 60 mm | | **Height** | 25 mm | | **Pitch** | Fine-Pitch | | **Thermal Resistance** | 6.26 °C/W (at 100 LFM) | --- ### 2. Key Features and Components The part is engineered to solve specific thermal challenges in PCB design: * **Heat Sink Material:** Made of Aluminum 6063, which provides an excellent balance of thermal conductivity and weight. * **Push-Pin Attachment:** Features a flexible, spring-loaded mechanism that ensures consistent pressure across the interface between the heat sink and the chip, improving heat transfer. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal grease used to fill microscopic air gaps. * **Finned Design:** Uses a high-density "cross-cut" or fine-pitch fin pattern to maximize surface area for convective cooling. --- ### 3. Thermal Performance Data Performance varies based on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.26 | | 200 (1.0 m/s) | 2.10 | | 300 (1.5 m/s) | 1.35 | | 500 (2.5 m/s) | 0.90 | --- ### 4. Part Number Breakdown The nomenclature follows the ATS pushPIN™ standard: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **01G:** Series/Base Model. * **25:** Height of the heat sink (25mm). * **C2:** Material/Color/Finish (Aluminum/Blue Anodized). * **R0:** Revision or specific packaging code. ---