The **ATS-01G-27-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" thermal management line designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | pushPIN™ (Plastic/Brass Pins + Springs) | | **Thermal Resistance** | 12.24 °C/W (at 1.0 m/s flow) | | **Dimensions (L x W)** | 70.00 mm x 45.00 mm | | **Height (Height Off Base)** | 12.70 mm | | **Fin Style** | XCUT (Cross-cut) | | **Fin Pitch** | Fine Pitch | --- ### 2. Breakdown of the Part Number The part number follows a standard nomenclature used by ATS to describe the component's attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **01G**: Series identifier (typically relates to the attachment style and base design). * **27**: Specific geometry/fin configuration code. * **C2**: Material and Finish code (C2 generally indicates **Blue Anodized Aluminum**). * **R0**: Revision or packaging code. --- ### 3. Key Electronic Functions While this is a passive mechanical part, its role in an electronic system is critical for stability: 1. **Thermal Dissipation**: It increases the surface area of the heat-generating component, allowing heat to transfer from the silicon die to the ambient air more efficiently. 2. **Cross-Cut (XCUT) Design**: The fins are cut in two directions. This allows air to flow through the heatsink from any direction (omni-directional), which is ideal for systems where airflow direction might be inconsistent. 3. **Mechanical Tension**: The `pushPIN™` system ensures constant pressure between the heatsink and the chip, which is vital for maintaining a solid interface with thermal interface material (TIM). --- ### 4. Application Use Cases * **Embedded Systems**: Cooling processors on small-form-factor motherboards. * **Telecommunications**: Cooling ASICs in networking switches or routers. * **Power Supplies**: Managing heat for MOSFETs or power regulators.