The **ATS-01G-30-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **push-pin** attachment family, designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimension (Length x Width)** | 54.00 mm x 38.00 mm | | **Height (Height off Base)** | 25.00 mm | | **Thermal Resistance (Unducted)** | 5.31 °C/W @ 200 LFM | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design Features The ATS-01G-30-C2-R0 incorporates several engineering features to optimize cooling efficiency: * **Straight Fin Pattern:** This design is optimized for environments with a steady flow of air (forced convection). The fins provide a high surface-area-to-volume ratio. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a spring-loaded brass push-pin mechanism. This ensures: * **Consistent Pressure:** Maintains optimal contact between the heat sink and the chip. * **Reliability:** Mechanical fastening is more robust than tape in high-vibration or high-heat environments. * **Pre-applied TIM:** It comes with **T766 thermal interface material**, which eliminates the need for separate thermal paste application during assembly. --- ### 3. Thermal Performance Profile Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM). As airflow increases, the efficiency of the heat sink improves significantly: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 7.93 | | 200 | 5.31 | | 400 | 3.51 | | 600 | 2.84 | --- ### 4. Typical Applications This part is commonly used in high-heat density electronic systems, including: * **Network Switches and Routers:** Cooling ASICs and Processors. * **Embedded Systems:** For industrial computers requiring stable thermal profiles. * **Power Supplies:** Heat dissipation for MOSFETs or power regulators.