The **ATS-01G-49-C2-R0** is a high-performance thermal management component specifically designed for cooling electronic integrated circuits (ICs). It belongs to the **pushPIN™** series manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its electronic and physical specifications. --- ### 1. General Specifications This part is a heat sink assembly designed to dissipate heat from surface-mount components (like CPUs, GPUs, or FPGAs) into the surrounding air. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Part Number** | ATS-01G-49-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pegs) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the heat sink fits within the PCB real estate and height constraints of the device enclosure. | Dimension | Measurement | | :--- | :--- | | **Length/Width (Square base)** | 30.00 mm x 30.00 mm | | **Height (Profile)** | 20.00 mm | | **Pitch (Fin spacing)** | Fine-Pitch | | **Weight** | ~40 grams | --- ### 3. Thermal Performance The efficiency of a heat sink is measured by its thermal resistance ($^\circ\text{C/W}$). A lower value indicates better heat dissipation. * **Thermal Resistance (Unducted Flow):** Approximately $5.48^\circ\text{C/W}$ at 200 LFM (Linear Feet per Minute). * **Thermal Resistance (Ducted Flow):** Performance improves significantly when airflow is contained, dropping to approximately $1.45^\circ\text{C/W}$ at higher velocities. --- ### 4. Technical Features * **Fin Design:** It uses a **cross-cut** or **straight fin** pattern (depending on the specific revision) optimized for multi-directional airflow. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a high-performance phase-change material that fills the microscopic gaps between the chip and the heat sink base. * **Attachment:** The `pushPIN™` system uses a flexible spring mechanism. This ensures consistent pressure (clamping force) on the electronic component, which prevents damage while maximizing thermal transfer. --- ### 5. Application Use Cases This part is commonly found in: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial controllers and IoT gateways. * **Computing:** Secondary cooling for chipsets or power management ICs.