The **ATS-01G-59-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to their "blue ice" or high-performance push-pin series. Below is a detailed breakdown of its electronic and mechanical specifications. ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-01G-59-C2-R0 | | **Component Type** | Passive Cooling / Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 7.94°C/W @ 100 LFM (Linear Feet per Minute) | | **Attachment Method** | Push-Pin (Plastic/Brass) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits within the PCB constraints and does not interfere with surrounding SMD (Surface Mount Device) components. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height (Fin height):** 20.00 mm * **Pitch (Hole spacing):** 45.00 mm (approx.) --- ### 3. Key Electronic Cooling Features #### A. Thermal Performance This heat sink is designed for **forced air cooling** environments. Its efficiency is measured by thermal resistance: * **High Flow (700 LFM):** ~1.62°C/W * **Low Flow (100 LFM):** ~7.94°C/W Lower thermal resistance means the component is more efficient at transferring heat away from the semiconductor. #### B. Material Properties The use of **AL6063 Aluminum** provides a balance between high thermal conductivity and structural integrity. The **Blue Anodized** finish isn't just aesthetic; it provides surface protection and slightly increases emissivity for better radiative heat transfer. #### C. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the "Push-Pin" mechanism ensures: 1. **Constant Pressure:** A spring-loaded pin maintains a firm interface between the heat sink and the chip. 2. **Reliability:** It is more resistant to mechanical shock and vibration than thermal tape. 3. **Repairability:** It can be easily removed and reattached during PCB rework. --- ### 4. Common Applications This specific size (40x40mm) is commonly found cooling the following electronic components: * **FPGAs** (Field Programmable Gate Arrays) * **ASICs** (Application-Specific Integrated Circuits) * **Network Processors** and high-speed Switch Chips. * **Power Converters** that generate significant localized heat. ---