The **ATS-01G-70-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **push-pin** heat sink family designed for board-level cooling. --- ### 1. General Specifications This part is a high-performance heat sink used to dissipate heat from integrated circuits (ICs) and other electronic surface-mount devices. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | ~14.15 °C/W (at 200 LFM) | | **Dimensions** | 45mm x 45mm x 25mm | --- ### 2. Physical Design and Construction The design of this heat sink focuses on optimizing airflow and surface area for maximum thermal transfer. * **Fin Style:** It utilizes a **Straight Fin** design. Straight fins are ideal for unidirectional airflow environments where a fan provides a consistent stream of air across the board. * **Material:** Made from **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. * **Anodization:** The "Blue Anodized" finish is not just for aesthetics; it provides surface protection against corrosion and increases the emissivity of the surface, slightly improving radiative cooling. --- ### 3. Attachment Mechanism: Push-Pin The "C2" in the part number refers to the specific attachment hardware. * **Pins:** It uses plastic push-pins that go through pre-drilled holes in the Printed Circuit Board (PCB). * **Springs:** The pins are paired with compression springs. This ensures a constant, even pressure is applied to the thermal interface material (TIM) and the chip, preventing air gaps and maximizing heat transfer. * **Hole Pattern:** This model typically requires a specific hole spacing (e.g., 38mm x 38mm) on the PCB. --- ### 4. Thermal Interface Material (TIM) For this specific model suffix (**R0**): * **Pre-Applied Material:** It usually comes with **T766** pre-applied. This is a high-performance Phase Change Material (PCM). * **Function:** When the chip heats up, the PCM softens or melts, filling the microscopic irregularities between the heat sink and the chip surface to minimize thermal resistance. --- ### 5. Application Use Cases You will typically find the ATS-01G-70-C2-R0 in the following electronic environments: 1. **Networking Hardware:** Switches, routers, and high-speed hubs. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Supplies:** Cooling voltage regulators or MOSFETs. 4. **Telecom:** High-bandwidth communication modules.