ATS-01G-73-C2-R0
AI

The **ATS-01G-73-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the thermal management category, specifically designed for high-performance heat dissipation in electronic assemblies.
### 1. Component Overview
This part is a **high-performance heat sink** utilizing the "push pin" attachment mechanism. It is designed to be mounted directly onto integrated circuits (ICs) like CPUs, GPUs, or FPGAs.
| Attribute | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-01G-73-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Plastic/Brass) |
| **Thermal Resistance** | Approx. 2.88°C/W (at 200 LFM) |
---
### 2. Physical Design & Dimensions
The "73" series features a specific fin geometry designed for optimal airflow.
* **Dimensions:** 45mm x 45mm base.
* **Height:** 20mm (Low profile for compact enclosures).
* **Fin Type:** Straight fin design, which is ideal for unidirectional airflow.
* **Thermal Interface Material (TIM):** Usually comes pre-applied with **T766** high-performance thermal phase change material.
---
### 3. Key Electronic Functions
While the part itself is passive (it does not consume electricity), it is critical for the electronic health of a system:
1. **Thermal Dissipation:** It increases the surface area of the heat-generating component, allowing for faster heat transfer into the surrounding air.
2. **Reliability Enhancement:** By keeping the junction temperature ($T_j$) of a semiconductor low, it prevents thermal throttling and extends the Mean Time Between Failures (MTBF).
3. **EMI Shielding (Secondary):** In some configurations, grounded aluminum heat sinks can provide a minor level of electromagnetic interference shielding for the chip underneath.
---
### 4. Technical Nomenclature Breakdown
The part number can be decoded as follows:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer Prefix |
| **01G** | Series Identifier (Push Pin design) |
| **73** | Specific dimensions/fin density code |
| **C2** | Thermal Interface Material (TIM) and color (Blue) |
| **R0** | Revision or packaging standard |
---
- ⤷
What are the different push pin material options for this series?
- ⤷ How does the thermal resistance change with different airflow speeds (LFM)?
- ⤷ Is this heat sink compatible with standard BGA chip footprints?