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  • ATS-01G-73-C2-R0

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    The **ATS-01G-73-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the thermal management category, specifically designed for high-performance heat dissipation in electronic assemblies. ### 1. Component Overview This part is a **high-performance heat sink** utilizing the "push pin" attachment mechanism. It is designed to be mounted directly onto integrated circuits (ICs) like CPUs, GPUs, or FPGAs. | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01G-73-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | Approx. 2.88°C/W (at 200 LFM) | --- ### 2. Physical Design & Dimensions The "73" series features a specific fin geometry designed for optimal airflow. * **Dimensions:** 45mm x 45mm base. * **Height:** 20mm (Low profile for compact enclosures). * **Fin Type:** Straight fin design, which is ideal for unidirectional airflow. * **Thermal Interface Material (TIM):** Usually comes pre-applied with **T766** high-performance thermal phase change material. --- ### 3. Key Electronic Functions While the part itself is passive (it does not consume electricity), it is critical for the electronic health of a system: 1. **Thermal Dissipation:** It increases the surface area of the heat-generating component, allowing for faster heat transfer into the surrounding air. 2. **Reliability Enhancement:** By keeping the junction temperature ($T_j$) of a semiconductor low, it prevents thermal throttling and extends the Mean Time Between Failures (MTBF). 3. **EMI Shielding (Secondary):** In some configurations, grounded aluminum heat sinks can provide a minor level of electromagnetic interference shielding for the chip underneath. --- ### 4. Technical Nomenclature Breakdown The part number can be decoded as follows: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer Prefix | | **01G** | Series Identifier (Push Pin design) | | **73** | Specific dimensions/fin density code | | **C2** | Thermal Interface Material (TIM) and color (Blue) | | **R0** | Revision or packaging standard | ---
    ✨ Follow-up Questions
    • ⤷ What are the different push pin material options for this series?
    • ⤷ How does the thermal resistance change with different airflow speeds (LFM)?
    • ⤷ Is this heat sink compatible with standard BGA chip footprints?