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  • ATS-01G-77-C2-R0

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    The **ATS-01G-77-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and electronic application profile. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 9.30°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | --- ### 2. Key Electronic Components #### A. Thermal Interface Material (TIM) The "R0" suffix indicates that this part comes pre-applied with a **Thermal Interface Material**. This is a specialized substance (usually a phase-change material or thermal grease) that fills microscopic air gaps between the heat sink and the electronic chip (CPU/GPU/ASIC), ensuring maximum heat transfer. #### B. The pushPIN™ System Unlike adhesive-based heat sinks, this part uses an electronic-safe mounting system: * **Compression Springs:** Provide precise pressure to the component, preventing mechanical stress on the PCB. * **Brass/Plastic Pins:** Secure the sink through pre-drilled holes in the circuit board. #### C. Fin Design (Fine Pitch) The "G" in the part number often refers to the specific fin density or geometry. This heat sink uses a **straight fin** or **cross-cut** design to allow air from a cooling fan to pass through easily, lowering the temperature of the underlying semiconductor. --- ### 3. Application Use Cases This specific model is typically used on the following electronic parts: * **Power Management ICs (PMICs):** For voltage regulators that generate significant heat. * **FPGAs & Microcontrollers:** Small-form-factor chips requiring active or passive cooling. * **Networking Gear:** Cooling chips in routers or switches where vertical space (20mm) is available. ---
    ✨ Follow-up Questions
    • ⤷ What are the specific hole patterns required on a PCB for this push-pin model?
    • ⤷ How does the thermal resistance change at higher airflow speeds (LFM)?
    • ⤷ Is this heat sink compatible with lead-free (RoHS) assembly processes?