ATS-01G-77-C2-R0
AI

The **ATS-01G-77-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** designed for cooling integrated circuits (ICs) and other electronic components.
Below is a detailed breakdown of its specifications and electronic application profile.
### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Spring-loaded) |
| **Thermal Resistance** | 9.30°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W x H)** | 25mm x 25mm x 20mm |
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### 2. Key Electronic Components
#### A. Thermal Interface Material (TIM)
The "R0" suffix indicates that this part comes pre-applied with a **Thermal Interface Material**. This is a specialized substance (usually a phase-change material or thermal grease) that fills microscopic air gaps between the heat sink and the electronic chip (CPU/GPU/ASIC), ensuring maximum heat transfer.
#### B. The pushPIN™ System
Unlike adhesive-based heat sinks, this part uses an electronic-safe mounting system:
* **Compression Springs:** Provide precise pressure to the component, preventing mechanical stress on the PCB.
* **Brass/Plastic Pins:** Secure the sink through pre-drilled holes in the circuit board.
#### C. Fin Design (Fine Pitch)
The "G" in the part number often refers to the specific fin density or geometry. This heat sink uses a **straight fin** or **cross-cut** design to allow air from a cooling fan to pass through easily, lowering the temperature of the underlying semiconductor.
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### 3. Application Use Cases
This specific model is typically used on the following electronic parts:
* **Power Management ICs (PMICs):** For voltage regulators that generate significant heat.
* **FPGAs & Microcontrollers:** Small-form-factor chips requiring active or passive cooling.
* **Networking Gear:** Cooling chips in routers or switches where vertical space (20mm) is available.
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- ⤷
What are the specific hole patterns required on a PCB for this push-pin model?
- ⤷ How does the thermal resistance change at higher airflow speeds (LFM)?
- ⤷ Is this heat sink compatible with lead-free (RoHS) assembly processes?