The **ATS-01G-90-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for thermal management in electronic systems, particularly for cooling Integrated Circuits (ICs) and other electronic components. --- ### ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions** | 35mm x 35mm x 25mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 6.36°C/W (at 100 LFM) | | **Finish** | Blue Anodized | --- ### ### Key Electronic Components & Features #### 1. Thermal Interface Material (TIM) The "C2" in the part number indicates that the unit comes pre-applied with **T766 thermal grease**. This is a crucial "electronic part" of the assembly that ensures maximum heat transfer between the semiconductor surface and the aluminum heat sink by filling microscopic air gaps. #### 2. Push-Pin Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system. * **Springs:** Provides consistent pressure (force) to ensure optimal contact with the electronic component. * **Hardware:** Designed for pre-drilled holes in a Printed Circuit Board (PCB). #### 3. Fin Design (Heat Dissipation) The straight-fin design is optimized for **forced air cooling** (active cooling via fans). In electronics, heat sinks like this are used to prevent "Thermal Throttling" or hardware failure in: * CPUs / GPUs * FPGAs (Field Programmable Gate Arrays) * ASICs (Application-Specific Integrated Circuits) * Power Transistors --- ### ### Performance Characteristics Thermal resistance is the most critical metric for this part. As airflow increases, the component's ability to dissipate heat improves significantly: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 6.36 | | 300 | 2.18 | | 500 | 1.42 | | 700 | 1.14 | ---