The **ATS-01G-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ HS Assembly | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | ~21.90° C/W (Unducted Flow) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Fin Style** | Straight Fin | | **Compliance** | RoHS Compliant | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body The body is made of extruded aluminum, which provides high thermal conductivity while remaining lightweight. The "91" in the part number indicates a specific fin pattern designed for optimized airflow. #### B. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, this part uses the **pushPIN™** system: * **Spring-loaded pins:** These provide a consistent, high-pressure contact between the heat sink and the component. * **Mechanical Stability:** It prevents the heat sink from shifting during vibration or mechanical shock. * **Easy Installation:** Designed for 2-hole mounting on a PCB. #### C. Thermal Interface Material (TIM) The "C3" suffix typically denotes that the heat sink comes with a **pre-applied Thermal Interface Material**. This is a layer of thermal grease or a phase-change pad on the base of the heat sink, ensuring there are no air gaps between the component and the metal. --- ### 3. Application Use Cases This specific heat sink is categorized as a "low profile" solution (10mm height), making it ideal for: * **1U/2U Rackmount Servers:** Where vertical space is strictly limited. * **Networking Gear:** Switches and routers. * **Embedded Systems:** Industrial PCs where high-density components generate concentrated heat. --- ### 4. Thermal Performance Data Performance varies based on the velocity of the air (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 21.90 | | 300 (1.5 m/s) | 5.30 | | 500 (2.5 m/s) | 3.50 |