The **ATS-01G-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the *pushPIN™* series manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications This part is designed for cooling electronic components like CPUs, GPUs, or high-power transistors. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-01G-95-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height** | 25.00 mm | | **Pitch** | Fine Pitch | --- ### 2. Electronic Component Characteristics #### Thermal Performance The efficiency of this part is measured by its thermal resistance (lower is better), which varies based on the airflow (LFM - Linear Feet per Minute): * **Unducted Flow:** 7.29 °C/W @ 100 LFM. * **Ducted Flow:** 1.39 °C/W @ 700 LFM. #### Mechanical Interface * **Push-Pin Attachment:** This model uses a plastic or brass push-pin with a compression spring. This ensures even pressure across the electronic chip, which optimizes the thermal interface material (TIM) performance. * **TIM (Thermal Interface Material):** Usually comes pre-applied with **T766** phase-change material to bridge the microscopic air gaps between the component and the heat sink. --- ### 3. Usage and Application This specific part is used in environments where vertical space is available (25mm height) and high-density heat dissipation is required. * **Target Components:** BGA (Ball Grid Array) packages, FPGAs, and power modules. * **Design Advantage:** The "Fine Pitch" fin design increases surface area, allowing for better heat transfer in systems with forced air cooling (fans). ---