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  • ATS-01G-97-C2-R0

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    The **ATS-01G-97-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure and efficient cooling of integrated circuits (ICs) and other electronic components. --- ### Technical Specifications | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-01G-97-C2-R0 | | **Heat Sink Type** | Blue Anodized Aluminum | | **Fin Type** | Straight Fin (Extrusion) | | **Attachment Method** | Push Pin (with Springs) | | **Thermal Resistance** | 16.90°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Material** | Aluminum 6063 | | **Finish** | Blue Anodized | --- ### Key Electronic & Physical Features #### 1. Push Pin Mounting System Unlike adhesive-based heat sinks, this model uses a **spring-loaded push pin** mechanism. * **Security:** Provides constant pressure to ensure optimal contact between the heat sink and the chip (via the Thermal Interface Material). * **Durability:** Resists vibration and shock better than thermal tape. #### 2. Thermal Performance (Efficiency) The efficiency of this part is measured by its thermal resistance. As airflow (LFM - Linear Feet per Minute) increases, the resistance drops significantly: * **@ 100 LFM:** 16.90 °C/W * **@ 700 LFM:** 4.10 °C/W #### 3. Low Profile Design With a height of only **10mm**, this component is designed for "Low Profile" applications. It is ideal for 1U servers, thin client devices, or any compact electronic enclosure where vertical space is limited. #### 4. Blue Anodized Finish The anodization isn't just for aesthetics; it provides **corrosion resistance** and improves the emissivity of the surface, slightly enhancing radiative heat transfer compared to raw aluminum. --- ### Common Applications * **Processors (CPUs/GPUs):** Cooling small embedded processors. * **FPGAs & ASICs:** Managing heat in programmable logic devices. * **Power Supplies:** Cooling voltage regulators or power transistors. * **Networking Gear:** Used in routers and switches to prevent thermal throttling.
    ✨ Follow-up Questions
    • ⤷What type of thermal interface material (TIM) is recommended for this heat sink?
    • ⤷ How do I calculate the correct hole diameter for the push pins?
    • ⤷ What are the advantages of straight fin vs. cross-cut fin designs?