The **ATS-01H-03-C2-R0** is a specific part number for a **high-performance heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "blue ICE" series designed for electronic component cooling. --- ### 1. Component Specifications Below are the technical specifications for this specific electronic cooling part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 26.32°C/W (Natural Convection) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Fin Style** | Straight Fin | --- ### 2. Physical Design & Features * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** phase-change material, which enhances heat transfer between the electronic chip (CPU, GPU, or FPGA) and the aluminum base. * **Push-Pin Attachment:** The "R0" suffix indicates a specific mounting kit. It uses two plastic push-pins and springs that fit into pre-drilled holes on a PCB. This ensures constant pressure and secure mechanical attachment. * **Straight Fin Geometry:** Designed primarily for **extruding heat** in a specific direction. It is most efficient when there is a dedicated airflow (active cooling) moving through the fins. --- ### 3. Applications This part is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling of high-speed processors in routers and switches. 2. **Embedded Systems:** Industrial PCs where vertical space is limited to 20mm. 3. **Power Electronics:** Dissipating heat from large MOSFETs or power regulators. --- ### 4. Thermal Performance Data Performance varies based on the airflow measured in Linear Feet per Minute (LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 12.35 | | 400 | 2.0 | 7.50 | | 600 | 3.0 | 5.50 | | 800 | 4.0 | 4.60 |