The **ATS-01H-147-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is a mechanical component, it is a critical part of electronic thermal management systems, specifically designed for cooling semiconductor devices like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Spring loaded) | | **Thermal Resistance** | 13.52°C/W (at 100 LFM) | | **Flow Orientation** | Vertical Fin (Straight) | --- ## 2. Key Electronic Functionality In an electronic circuit, this part serves the following roles: ### Thermal Dissipation The primary purpose is to increase the surface area of a heat-generating component. The "C2" in the part number indicates a specific **Thermal Interface Material (TIM)**—usually a pre-applied phase-change material or thermal tape—which ensures there are no air gaps between the electronic chip and the aluminum body. ### Attachment Mechanism (pushPIN™) Unlike simple glue-on heat sinks, the **ATS-01H-147-C2-R0** uses a push-pin system with a brass or plastic pin and a stainless steel spring. * **Pressure Management:** It provides consistent pressure across the chip, which is vital for maintaining electrical and thermal contact without cracking the silicon die. * **Vibration Resistance:** The spring-loaded nature makes it suitable for electronics used in industrial or automotive environments where vibration is common. ### Material Properties * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Anodized Finish:** The blue anodizing is not just aesthetic; it provides a layer of electrical insulation and increases the surface emissivity, slightly improving radiant cooling. --- ## 3. Applications This specific heat sink is typically found in: 1. **Network Switches:** Cooling ASICs or small processors. 2. **Power Supplies:** Managing heat for MOSFETs or voltage regulators. 3. **Embedded Systems:** Industrial PCs where space is limited (10mm low profile).