ATS-01H-152-C2-R0
AI

The **ATS-01H-152-C2-R0** is a high-performance heat sink manufactured by Advanced Thermal Solutions (ATS). It is specifically designed to manage the thermal profiles of electronic components like CPUs, GPUs, and other high-heat integrated circuits.
### 1. Technical Specifications
The following table summarizes the physical and thermal characteristics of this part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance (Flow)** | 3.32 °C/W @ 100 LFM |
| **Thermal Resistance (Static)** | 2.11 °C/W @ 700 LFM |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm |
| **Fin Type** | Fine Pitch (straight) |
---
### 2. Core Features
#### A. pushPIN™ Attachment System
The part utilizes the proprietary **pushPIN™** system. This mechanism ensures:
* **Constant Pressure:** The spring-loaded pins provide a specific, repeatable force to the component, ensuring optimal thermal interface material (TIM) performance.
* **Secure Mounting:** It prevents the heat sink from shifting during vibration or mechanical shock.
* **Ease of Assembly:** Quick installation through pre-drilled holes in the PCB.
#### B. Thermal Performance
The "C2" designation in the part number indicates a **Blue Anodized** finish. While aesthetically pleasing, this finish also increases the surface emissivity, slightly improving radiation heat transfer. The high-aspect-ratio fin design maximizes surface area within a compact 35mm footprint.
---
### 3. Applications
This heat sink is commonly found in the following electronic environments:
* **Telecommunications:** Cooling of high-speed networking chips.
* **Industrial PCs:** Thermal management for embedded processors.
* **Power Supplies:** Heat dissipation for MOSFETs or power ICs.
---
### 4. Part Number Breakdown
The nomenclature for this series follows a specific logic:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **01H** | Product series / Profile |
| **152** | Specific dimensional variant |
| **C2** | Color/Finish (Blue Anodized) |
| **R0** | RoHS Compliant status |
- ⤷
What are the PCB hole requirements for the pushPIN system used in this heat sink?
- ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
- ⤷ Are there alternative finishes to C2 for different environmental requirements?