ATS-01H-16-C2-R0
AI

The **ATS-01H-16-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to the **blueICE™** series.
Below is a detailed breakdown of its electronic and mechanical specifications.
### 1. General Specifications
| Feature | Detail |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Part Number** | ATS-01H-16-C2-R0 |
| **Product Category** | Passive Cooling / Heat Sinks |
| **Attachment Method** | Push-Pin (with springs) |
| **Thermal Interface Material** | T766 (Pre-applied) |
---
### 2. Physical Dimensions
This heat sink is designed for square-shaped electronic components such as CPUs, GPUs, or high-power FPGAs.
| Dimension | Measurement |
| :--- | :--- |
| **Length/Width** | 54.00mm x 54.00mm |
| **Height (Fin Height)** | 12.70mm |
| **Mounting Hole Spacing** | 47.00mm |
---
### 3. Thermal Performance
Thermal resistance indicates how effectively the heat sink moves heat away from the electronic component. It is measured in degrees Celsius per Watt (°C/W).
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 LFM (Unducted) | 18.08 |
| 300 LFM (Unducted) | 8.36 |
| 400 LFM (Unducted) | 5.84 |
| 700 LFM (Unducted) | 2.99 |
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### 4. Key Component Features
* **Material:** Constructed from high-quality **Aluminum**, providing a balance between weight and thermal conductivity.
* **Finish:** Blue Anodized. This layer prevents corrosion and improves radiation heat transfer.
* **Fin Style:** Straight fin design, optimized for high-speed airflow environments.
* **Push-Pin Mounting:** Uses a spring-loaded push-pin mechanism. This provides consistent pressure (clamping force) on the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM).
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### 5. Application Usage
This part is typically found in:
1. **Telecommunications:** High-speed routers and switches.
2. **Computing:** Embedded systems and industrial motherboards.
3. **Power Electronics:** Cooling voltage regulators or power modules.
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How do I calculate the required airflow for this heat sink?
- ⤷ What are the benefits of the T766 thermal interface material used here?
- ⤷ Does this heat sink support customized mounting hole layouts?