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  • ATS-01H-16-C2-R0

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    The **ATS-01H-16-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to the **blueICE™** series. Below is a detailed breakdown of its electronic and mechanical specifications. ### 1. General Specifications | Feature | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-01H-16-C2-R0 | | **Product Category** | Passive Cooling / Heat Sinks | | **Attachment Method** | Push-Pin (with springs) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Physical Dimensions This heat sink is designed for square-shaped electronic components such as CPUs, GPUs, or high-power FPGAs. | Dimension | Measurement | | :--- | :--- | | **Length/Width** | 54.00mm x 54.00mm | | **Height (Fin Height)** | 12.70mm | | **Mounting Hole Spacing** | 47.00mm | --- ### 3. Thermal Performance Thermal resistance indicates how effectively the heat sink moves heat away from the electronic component. It is measured in degrees Celsius per Watt (°C/W). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 LFM (Unducted) | 18.08 | | 300 LFM (Unducted) | 8.36 | | 400 LFM (Unducted) | 5.84 | | 700 LFM (Unducted) | 2.99 | --- ### 4. Key Component Features * **Material:** Constructed from high-quality **Aluminum**, providing a balance between weight and thermal conductivity. * **Finish:** Blue Anodized. This layer prevents corrosion and improves radiation heat transfer. * **Fin Style:** Straight fin design, optimized for high-speed airflow environments. * **Push-Pin Mounting:** Uses a spring-loaded push-pin mechanism. This provides consistent pressure (clamping force) on the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM). --- ### 5. Application Usage This part is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Computing:** Embedded systems and industrial motherboards. 3. **Power Electronics:** Cooling voltage regulators or power modules.
    ✨ Follow-up Questions
    • ⤷ How do I calculate the required airflow for this heat sink?
    • ⤷ What are the benefits of the T766 thermal interface material used here?
    • ⤷ Does this heat sink support customized mounting hole layouts?