The **ATS-01H-183-C2-R0** is a high-performance electronic component classified as a **Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to the **pushPIN™** series. Below is a detailed breakdown of its electronic and mechanical specifications. ### 1. General Specifications | Feature | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-01H-183-C2-R0 | | **Series** | pushPIN™ | | **Type** | Top Mount Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCB constraints without interfering with other surface-mount devices (SMDs). | Dimension | Measurement | | :--- | :--- | | **Length** | 40.00 mm | | **Width** | 40.00 mm | | **Height (Fin)** | 20.00 mm | | **Pitch (Hole-to-Hole)** | 45.00 mm | --- ### 3. Thermal Performance The efficiency of a heat sink is measured by its **Thermal Resistance**. Lower values indicate better heat dissipation. * **Unducted Flow (Steady Air):** 5.37 °C/W @ 100 LFM (Linear Feet per Minute). * **Ducted Flow:** 2.85 °C/W @ 100 LFM. * **Performance at High Velocity:** Thermal resistance drops significantly as airflow increases (e.g., ~1.60 °C/W @ 700 LFM). --- ### 4. Key Electronic Design Features #### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a **push-pin and brass spring** mechanism. * **Reliability:** Ensures consistent pressure (clamping force) on the high-heat component (CPU, FPGA, or GPU). * **Standardization:** Features a pre-drilled hole pattern for easy integration into PCB designs. #### B. Thermal Interface Material (TIM) The "R0" suffix indicates that this part typically comes with **T766** pre-applied thermal phase-change material. This eliminates the need for manual application of thermal paste, ensuring an even and efficient thermal bridge between the chip and the aluminum fins. #### C. Cross-Cut Fin Design The fin pattern is "Cross-Cut," which allows for multi-directional airflow. This is vital in densely packed electronic enclosures where air may not flow in a perfectly linear path. --- ### 5. Common Applications * **Voltage Regulator Modules (VRMs):** Cooling power-delivery components. * **Processors/SoCs:** Small form factor CPUs or high-speed ARM chips. * **Network Switches:** Cooling ASICs that manage high-speed data traffic.