The **ATS-01H-19-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum (Blue Anodized) | | **Mounting Type** | Push-Pin (Brass) | | **Thermal Resistance** | 9.77°C/W @ 100 LFM | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Elements #### A. Material and Coating * **Aluminum Construction:** Offers a balance between weight and thermal conductivity. * **Blue Anodization:** This is not just for aesthetics; the anodized layer increases emissivity, slightly improving radiant heat transfer, and protects the aluminum from corrosion. #### B. Mounting Mechanism (Push-Pins) * **Ease of Assembly:** It uses brass push-pins with springs. This ensures constant pressure (clamping force) between the heat sink and the component, which is critical for maximizing thermal transfer. * **Stability:** The 4-corner or 2-corner push-pin design prevents the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) * The part comes with **T766** pre-applied. This eliminates the need for manual thermal paste application, reducing assembly time and ensuring a consistent, thin layer for optimal heat dissipation. --- ### 3. Performance Data (Airflow) The effectiveness of the ATS-01H-19-C2-R0 depends heavily on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM). | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 9.77 | | 200 | 6.30 | | 300 | 4.66 | | 400 | 3.89 | --- ### 4. Typical Applications * **Integrated Circuits (ICs):** Cooling FPGAs and ASICs in networking equipment. * **Power Electronics:** Dissipating heat from voltage regulators. * **Embedded Systems:** Used in industrial PCs where space is limited but high reliability is required.