ATS-01H-191-C2-R0
AI

The **ATS-01H-191-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Attachment Type** | Push Pin |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height (H)** | 30mm |
| **Thermal Resistance** | 2.90°C/W (at 100 LFM) |
| **Fin Style** | Fine Pitch (Straight Fin) |
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### Key Component Features
#### 1. Heat Sink Geometry
* **Dimensions:** The 45mm x 45mm footprint is standard for mid-sized processors and high-power integrated circuits (ICs).
* **Height:** At 30mm, this is a "tall" profile heat sink, offering a large surface area for heat exchange, but it requires sufficient vertical clearance in the chassis.
#### 2. Push Pin Attachment
* This model uses a **Push Pin** mounting mechanism rather than adhesive.
* **Benefits:** Provides consistent pressure (clamping force) on the chip, which improves thermal transfer and ensures the sink stays attached during mechanical shock or vibration.
#### 3. Material and Coating
* **Aluminum:** Lightweight and offers excellent thermal conductivity for the cost.
* **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer increases surface emissivity (improving radiation cooling) and provides corrosion resistance.
#### 4. Thermal Performance
The thermal resistance of **2.90°C/W** indicates that for every 1 Watt of power the chip produces, its temperature will rise 2.90°C above the ambient air temperature (assuming a low airflow of 100 LFM).
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### Comparison: Fine Pitch vs. Coarse Pitch
The ATS-01H-191-C2-R0 is part of the **Fine Pitch** line.
```python
# Conceptual logic for choosing this part:
if airflow_velocity >= "Medium":
use_part = "Fine Pitch (ATS-01H-191-C2-R0)" # More fins = more surface area
else:
use_part = "Coarse Pitch" # Fewer fins = less air resistance (pressure drop)
```
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- ⤷
What are the recommended push pin hole sizes for this specific heat sink model?
- ⤷ How do I calculate if 2.90°C/W is sufficient for my specific processor's TDP?
- ⤷ Does this model come with pre-applied Thermal Interface Material (TIM)?