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  • ATS-01H-191-C2-R0

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    The **ATS-01H-191-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (H)** | 30mm | | **Thermal Resistance** | 2.90°C/W (at 100 LFM) | | **Fin Style** | Fine Pitch (Straight Fin) | --- ### Key Component Features #### 1. Heat Sink Geometry * **Dimensions:** The 45mm x 45mm footprint is standard for mid-sized processors and high-power integrated circuits (ICs). * **Height:** At 30mm, this is a "tall" profile heat sink, offering a large surface area for heat exchange, but it requires sufficient vertical clearance in the chassis. #### 2. Push Pin Attachment * This model uses a **Push Pin** mounting mechanism rather than adhesive. * **Benefits:** Provides consistent pressure (clamping force) on the chip, which improves thermal transfer and ensures the sink stays attached during mechanical shock or vibration. #### 3. Material and Coating * **Aluminum:** Lightweight and offers excellent thermal conductivity for the cost. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer increases surface emissivity (improving radiation cooling) and provides corrosion resistance. #### 4. Thermal Performance The thermal resistance of **2.90°C/W** indicates that for every 1 Watt of power the chip produces, its temperature will rise 2.90°C above the ambient air temperature (assuming a low airflow of 100 LFM). --- ### Comparison: Fine Pitch vs. Coarse Pitch The ATS-01H-191-C2-R0 is part of the **Fine Pitch** line. ```python # Conceptual logic for choosing this part: if airflow_velocity >= "Medium": use_part = "Fine Pitch (ATS-01H-191-C2-R0)" # More fins = more surface area else: use_part = "Coarse Pitch" # Fewer fins = less air resistance (pressure drop) ``` ---
    ✨ Follow-up Questions
    • ⤷ What are the recommended push pin hole sizes for this specific heat sink model?
    • ⤷ How do I calculate if 2.90°C/W is sufficient for my specific processor's TDP?
    • ⤷ Does this model come with pre-applied Thermal Interface Material (TIM)?