The **ATS-01H-199-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Dimensions (L x W x H)** | 50mm x 50mm x 6mm | | **Thermal Resistance** | 15.83°C/W (Unducted Flow @ 100 LFM) | | **Weight** | 18.00 grams | --- ### Core Components and Features #### 1. Heat Sink Body The body is made of **Aluminum**, chosen for its excellent thermal conductivity and lightweight properties. The low profile (6mm height) makes it ideal for dense electronic assemblies or thin enclosures where vertical space is limited. #### 2. Fin Configuration The part uses a **Straight Fin** design. * **Thermal Performance:** The fins increase the surface area available for heat transfer to the surrounding air. * **Airflow:** This specific model is optimized for both natural convection and forced air (fans). #### 3. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or complex brackets, this part uses the **pushPIN™** system: * **Spring-Loaded:** Provides consistent pressure across the thermal interface material (TIM). * **Installation:** Uses pre-drilled holes in the PCB for a secure mechanical connection. * **Reliability:** Resistant to shock and vibration compared to "peel-and-stick" solutions. #### 4. Thermal Interface Material (TIM) The "C2" in the part number typically indicates that the heat sink comes with a **T766** phase-change material or equivalent high-performance thermal pad pre-applied to the base. This fills microscopic air gaps between the component and the heat sink. --- ### Use Cases in Electronics * **Embedded Systems:** Cooling processors in industrial computers. * **Telecommunications:** Heat dissipation for high-speed networking chips. * **Power Electronics:** Cooling voltage regulators or power MOSFETs.