The **ATS-01H-20-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions** | 54mm x 54mm x 20mm | | **Thermal Resistance** | 7.14°C/W (Natural Convection) | | **Fin Style** | Straight Fin | --- ### 2. Electronic Application & Performance The "C2" in the part number indicates the use of a specific **Thermal Interface Material (TIM)**, which is crucial for electronic efficiency. * **Thermal Performance:** In forced air cooling (airflow), the thermal resistance drops significantly (e.g., as low as 1.15°C/W at high velocity), allowing high-power electronic chips to maintain a safe Junction Temperature ($T_j$). * **Attachment Logic:** The push-pin mechanism provides a specific **clamping force**. This ensures the heat sink makes constant contact with the electronic package without cracking the delicate silicon die. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides a small degree of electrical insulation and increases the surface emissivity, aiding in heat radiation. --- ### 3. Component Breakdown (Naming Convention) The part number can be decoded to understand its electronic fitment: | Part Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **01H** | Product Series (High Performance) | | **20** | Height of the heat sink (20mm) | | **C2** | Thermal Interface Material (T766 Phase Change Material) | | **R0** | RoHS Compliant (Lead-free) | --- ### 4. Integration Considerations When integrating this part into a PCB design: * **Hole Pattern:** The PCB must have pre-drilled holes matching the push-pin pitch. * **Component Clearance:** Ensure a 54mm x 54mm keep-out zone around the target chip to accommodate the aluminum base. * **Airflow Direction:** Straight fins are sensitive to airflow direction; for maximum efficiency, air should flow parallel to the channels between the fins.