ATS-01H-202-C2-R0
AI

The **ATS-01H-202-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the blue anodized "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and power modules.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Part Number** | ATS-01H-202-C2-R0 |
| **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm |
| **Material** | Aluminum |
| **Fin Style** | Straight (Standard Profile) |
| **Attachment Method** | Push-Pin (2-Pins) |
| **Thermal Resistance** | 14.83°C/W (Natural Convection) |
| **Finish** | Blue Anodized |
| **Interface Material** | T766 (Thermal Tape/Phase Change) |
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### 2. Key Electronic Features
#### A. Thermal Management
Electronic components generate heat that can lead to thermal throttling or permanent failure. The ATS-01H-202-C2-R0 acts as a passive heat exchanger, increasing the surface area of the component to dissipate heat into the surrounding air.
#### B. Push-Pin Attachment Mechanism
Unlike adhesive-only heat sinks, this part uses a mechanical **Push-Pin** system with a built-in spring. This provides several electronic and mechanical benefits:
* **Constant Pressure:** Ensures consistent contact between the die and the heat sink.
* **Vibration Resistance:** Securely holds the part in place during transport or industrial vibration.
* **Pre-drilled PCB Holes:** Requires specific hole patterns on the PCB for mounting.
#### C. Thermal Interface Material (TIM)
The "C2" suffix indicates that the heat sink comes pre-applied with **T766 thermal interface material**. This is a high-performance phase-change material that fills microscopic air gaps between the chip and the aluminum, significantly lowering thermal resistance.
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### 3. Application Use Cases
This part is commonly used in the following electronic systems:
* **Telecommunications:** High-speed routers and switches.
* **Embedded Systems:** Industrial PC boards and controllers.
* **Power Supplies:** Cooling voltage regulators and MOSFETs.
* **Medical Equipment:** High-reliability diagnostic hardware.
- ⤷
What is the hole pattern requirement for the push-pin mounting of this heat sink?
- ⤷ How does the T766 interface material compare to standard thermal grease?
- ⤷ What are the airflow requirements to achieve the maximum cooling efficiency for this model?