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  • ATS-01H-202-C2-R0

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    The **ATS-01H-202-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the blue anodized "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-01H-202-C2-R0 | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm | | **Material** | Aluminum | | **Fin Style** | Straight (Standard Profile) | | **Attachment Method** | Push-Pin (2-Pins) | | **Thermal Resistance** | 14.83°C/W (Natural Convection) | | **Finish** | Blue Anodized | | **Interface Material** | T766 (Thermal Tape/Phase Change) | --- ### 2. Key Electronic Features #### A. Thermal Management Electronic components generate heat that can lead to thermal throttling or permanent failure. The ATS-01H-202-C2-R0 acts as a passive heat exchanger, increasing the surface area of the component to dissipate heat into the surrounding air. #### B. Push-Pin Attachment Mechanism Unlike adhesive-only heat sinks, this part uses a mechanical **Push-Pin** system with a built-in spring. This provides several electronic and mechanical benefits: * **Constant Pressure:** Ensures consistent contact between the die and the heat sink. * **Vibration Resistance:** Securely holds the part in place during transport or industrial vibration. * **Pre-drilled PCB Holes:** Requires specific hole patterns on the PCB for mounting. #### C. Thermal Interface Material (TIM) The "C2" suffix indicates that the heat sink comes pre-applied with **T766 thermal interface material**. This is a high-performance phase-change material that fills microscopic air gaps between the chip and the aluminum, significantly lowering thermal resistance. --- ### 3. Application Use Cases This part is commonly used in the following electronic systems: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PC boards and controllers. * **Power Supplies:** Cooling voltage regulators and MOSFETs. * **Medical Equipment:** High-reliability diagnostic hardware.
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern requirement for the push-pin mounting of this heat sink?
    • ⤷ How does the T766 interface material compare to standard thermal grease?
    • ⤷ What are the airflow requirements to achieve the maximum cooling efficiency for this model?