The **ATS-01H-24-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | ATS-PPS-01 | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Electronic & Thermal Components #### 1. Heat Sink Body (Aluminum 6063) The core of the part is made from **Aluminum 6063**, chosen for its excellent thermal conductivity (approx. 200 W/m·K) and structural integrity. The "24" in the part number corresponds to the specific fin geometry designed for optimal airflow. #### 2. Thermal Interface Material (TIM) - T766 The base comes pre-applied with **T766 phase-change material**. - **Function:** It fills microscopic air gaps between the heat sink base and the electronic component (die). - **Benefit:** Since air is a poor conductor, the TIM significantly reduces "Contact Resistance," allowing heat to flow efficiently into the aluminum. #### 3. pushPIN™ Mounting System This model utilizes a mechanical fastening system rather than adhesive. - **Push-Pins:** These provide consistent pressure (clamping force) across the component. - **Springs:** The ATS-PPS-01 springs ensure that even under vibration or thermal expansion, the heat sink maintains firm contact with the electronic chip. --- ### Performance Metrics The thermal resistance of this part depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 12.36 | | 400 (2.0 m/s) | 1.76 | | 700 (3.5 m/s) | 1.13 | --- ### Application Usage This part is typically found in: * **Telecommunications:** Cooling high-speed networking processors. * **Power Electronics:** Dissipating heat from MOSFETs or IGBTs. * **Embedded Systems:** Industrial PCs where space is limited (15mm height).