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  • ATS-01H-25-C2-R0

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    The **ATS-01H-25-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **push-PIN™** series of high-performance heat sinks designed for cooling integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | push-PIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Style** | Straight (Fine Pitch) | | **Thermal Resistance** | 6.26 °C/W (@ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Dimensional Data Precise sizing is critical for ensuring the heat sink fits within the constraints of a Printed Circuit Board (PCB). | Dimension | Value (mm) | | :--- | :--- | | **Width (Length)** | 60.00 mm | | **Width (Cross)** | 60.00 mm | | **Height** | 25.00 mm | | **Hole Spacing** | 53.00 mm | --- ## 3. Key Features and Applications ### A. Attachment System The "push-PIN" system uses a flexible, spring-loaded mechanism. * **Benefits:** Ensures a constant pressure against the chip for optimal heat transfer. * **Assembly:** It is designed for quick manual assembly onto the PCB without specialized tools. ### B. Material & Coating * **Aluminum:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides electrical insulation and improves surface emissivity, aiding in radiant heat transfer. ### C. Target Components This part is typically used to cool: * CPUs (Central Processing Units) * FPGAs (Field Programmable Gate Arrays) * ASICs (Application Specific Integrated Circuits) * Power modules in industrial or networking environments. --- ## 4. Part Number Breakdown The nomenclature provides specific details about the component: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **01:** Series identifier. * **H:** High performance. * **25:** Height of the heat sink (25mm). * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code.
    ✨ Follow-up Questions
    • ⤷ How do I calculate the required thermal resistance for my specific IC?
    • ⤷ What are the alternatives to push-pin mounting for heat sinks?
    • ⤷ Does the T766 thermal interface material require curing?