ATS-01H-25-C2-R0
AI

The **ATS-01H-25-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **push-PIN™** series of high-performance heat sinks designed for cooling integrated circuits (ICs) and other electronic components.
---
## 1. Technical Specifications
Below are the primary physical and thermal characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Series** | push-PIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Fin Style** | Straight (Fine Pitch) |
| **Thermal Resistance** | 6.26 °C/W (@ 100 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
---
## 2. Dimensional Data
Precise sizing is critical for ensuring the heat sink fits within the constraints of a Printed Circuit Board (PCB).
| Dimension | Value (mm) |
| :--- | :--- |
| **Width (Length)** | 60.00 mm |
| **Width (Cross)** | 60.00 mm |
| **Height** | 25.00 mm |
| **Hole Spacing** | 53.00 mm |
---
## 3. Key Features and Applications
### A. Attachment System
The "push-PIN" system uses a flexible, spring-loaded mechanism.
* **Benefits:** Ensures a constant pressure against the chip for optimal heat transfer.
* **Assembly:** It is designed for quick manual assembly onto the PCB without specialized tools.
### B. Material & Coating
* **Aluminum:** Chosen for its excellent thermal conductivity and lightweight properties.
* **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides electrical insulation and improves surface emissivity, aiding in radiant heat transfer.
### C. Target Components
This part is typically used to cool:
* CPUs (Central Processing Units)
* FPGAs (Field Programmable Gate Arrays)
* ASICs (Application Specific Integrated Circuits)
* Power modules in industrial or networking environments.
---
## 4. Part Number Breakdown
The nomenclature provides specific details about the component:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **01:** Series identifier.
* **H:** High performance.
* **25:** Height of the heat sink (25mm).
* **C2:** Material/Finish code (Blue Anodized).
* **R0:** Revision or packaging code.
- ⤷
How do I calculate the required thermal resistance for my specific IC?
- ⤷ What are the alternatives to push-pin mounting for heat sinks?
- ⤷ Does the T766 thermal interface material require curing?