ATS-01H-30-C2-R0
AI

The **ATS-01H-30-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as CPUs, GPUs, and power transistors in high-airflow environments.
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### Technical Specifications
The following table outlines the physical and thermal characteristics of the component:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 57.90mm x 36.83mm x 22.86mm |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 5.31°C/W (at 200 LFM) |
| **Flow Orientation** | Horizontal |
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### Key Components & Features
1. **Material and Finish**:
* Made from **Aluminum 6063**, which provides an excellent balance of thermal conductivity and weight.
* The **Blue Anodized** finish is not just aesthetic; it increases surface emissivity and provides corrosion resistance.
2. **Fin Design**:
* It features a **straight-fin** (high-aspect ratio) geometry. This is optimized for forced-air cooling (fan-driven) where air can pass through the channels with minimal pressure drop.
3. **Attachment System (Push-Pins)**:
* The "H" in the part number indicates a specific push-pin and spring assembly.
* **Push-pins** allow for quick manual installation onto a PCB with pre-drilled holes, ensuring consistent pressure for optimal thermal contact.
4. **Thermal Interface Material (TIM)**:
* This specific part number typically comes with **T766** pre-applied thermal phase-change material or a similar pad, which fills microscopic air gaps between the component and the heat sink.
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### Thermal Performance Chart
(Estimated performance based on airflow)
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 | 5.31 |
| 400 | 2.19 |
| 600 | 1.63 |
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### Usage Guidelines
* **Application**: Best used for components generating moderate heat where vertical space is limited to roughly 23mm.
* **Mounting**: Ensure the PCB hole pattern matches the 4-corner push-pin layout of the ATS-01H series.
* **Maintenance**: Ensure the fins remain free of dust to maintain the specified thermal resistance.
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What are the specific PCB hole dimensions required for the ATS-01H-30-C2-R0?
- ⤷ How does 'Blue Anodized' compare to 'Black Anodized' in terms of thermal performance?
- ⤷ Can this heat sink be used in natural convection (no fan) environments?