The **ATS-01H-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Flowing Air)** | 17.42°C/W @ 100 LFM (linear feet per minute) | | **Thermal Resistance (Static Air)** | 5.92°C/W (at high velocity) | | **Attachment Method** | Push-pin (Brass) | | **Spring Type** | Compression Spring (ATS-PPS-01) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits within the PCB layout and clearance requirements. | Dimension | Measurement | | :--- | :--- | | **Base Length** | 35.00 mm | | **Base Width** | 35.00 mm | | **Height** | 20.00 mm | | **Hole Spacing** | 40.00 mm | --- ### 3. Key Electronic/Mechanical Features * **Fin Profile:** This heat sink features a **Square Pin Fin** design. Pin fins are omnidirectional, meaning they can receive airflow from any direction, making them ideal for complex enclosures where air paths are not linear. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, the `ATS-01H-33-C2-R0` uses a mechanical push-pin system. This provides a consistent "clamping force" (pressure) which ensures optimal contact between the electronic component and the heat sink. * **T766 Thermal Interface:** The part comes with a pre-applied Phase Change Material (PCM). This fills the microscopic air gaps between the chip and the heat sink to maximize heat transfer efficiency. * **Material Efficiency:** The aluminum construction offers a balance between lightweight design and high thermal conductivity ($k \approx 200 \text{ W/m·K}$). --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Networking:** Small routers, switches, and SFP modules. * **Power Supplies:** MOSFET or Voltage Regulator (VRM) cooling. * **Consumer Electronics:** High-end audio/video processing chips.