The **ATS-01H-40-C2-R0** is a specific model of a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components, primarily BGA (Ball Grid Array) packages like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 57.90mm x 60.96mm | | **Height (Fin)** | 15.24mm | | **Thermal Resistance** | 14.56°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Standard) | | **Pressure Spring** | Stainless Steel / Plastic | --- ### 2. Key Component Features #### A. pushPIN™ Attachment Unlike adhesive tapes or simple clips, this model uses a **pushPIN™ system**. This provides: * **Constant Pressure:** Ensures a firm interface between the heat sink and the processor for optimal thermal transfer. * **Secure Mounting:** Prevents the heat sink from shifting during mechanical shock or vibration. * **Pre-drilled Holes:** Designed to fit specific PCB hole patterns. #### B. Fin Design (Cross-Cut) The unit features a **straight fin or cross-cut design** (depending on the specific series configuration). This allows for: * **Omnidirectional Airflow:** If cross-cut, it can receive cooling air from any direction. * **High Surface Area:** Maximizes the area available for heat to escape into the ambient air. #### C. Thermal Interface Material (TIM) The "R0" suffix often indicates the inclusion of a pre-applied **Thermal Interface Material**. This eliminates the need for manual application of thermal paste, ensuring a clean and efficient thermal bond out of the box. --- ### 3. Electronic Application Example When integrating this into a circuit board design, engineers typically use it for mid-to-high-wattage chips. Here is a conceptual representation of how it is defined in a Bill of Materials (BOM): ```json { "PartNumber": "ATS-01H-40-C2-R0", "Category": "Thermal Management", "SubCategory": "Heat Sinks", "MountingType": "Through-Hole (pushPIN)", "Material": "Aluminum 6063", "PackageCooled": "BGA / Board Level" } ``` --- ### 4. Why Use the Blue Anodized Finish? The blue anodization is not just for aesthetics; it provides: 1. **Corrosion Resistance:** Protects the aluminum from oxidation. 2. **Increased Emissivity:** Improves the radiant heat transfer capabilities compared to bare polished aluminum. 3. **Electrical Insulation:** The oxide layer is non-conductive, reducing the risk of short circuits if the sink accidentally touches a live trace.