The **ATS-01H-47-C2-R0** is a specific electronic cooling component known as a **Heat Sink**. It is manufactured by *Advanced Thermal Solutions, Inc. (ATS)* and belongs to their "pushPIN™" series. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Thermal Management) | | **Material** | Aluminum | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Fin Style** | Straight Fin | | **Finish** | Blue Anodized | | **Thermal Resistance** | 9.30°C/W (Unducted Flow @ 100 LFM) | | **Thermal Resistance** | 2.49°C/W (Ducted Flow @ 200 LFM) | --- ## Key Dimensions The physical footprint of the heat sink is crucial for PCB layout and component clearance: * **Length (Width):** 25.00 mm * **Width (Depth):** 25.00 mm * **Height:** 20.00 mm * **Pitch (Hole spacing):** 30.00 mm x 30.00 mm --- ## Design and Functionality ### 1. Thermal Dissipation The heat sink is designed to pull heat away from active electronic components (like CPUs, MOSFETs, or ASICs) via conduction and dissipate it into the surrounding air via convection. The "straight fin" design is optimized for environments where there is a consistent directional airflow. ### 2. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a **pushPIN™** system. * **Components:** It includes a flexible spring-loaded pin. * **Benefit:** It provides a specific, consistent pressure on the thermal interface material (TIM), ensuring maximum heat transfer while allowing for easy installation and removal without damaging the PCB. ### 3. Material and Coating * **Aluminum:** Chosen for its excellent weight-to-thermal conductivity ratio. * **Blue Anodized:** The surface treatment prevents corrosion and increases the surface emissivity, slightly improving radiation heat transfer. ### 4. Application Use-Cases * Small form-factor electronics. * Networking equipment (Routers, Switches). * Embedded systems requiring moderate cooling in a 25mm footprint.