The **ATS-01H-50-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimension (Length x Width)** | 35mm x 35mm | | **Height** | 15mm | | **Thermal Resistance** | 19.03 °C/W (Unducted Flow @ 100 LFM) | | **Fin Type** | Fine Pitch (Straight Fin) | --- ### 2. Key Component Features #### A. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, this model uses a **pushPIN™** system. This consists of: * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Provide precise "Firm" pressure to ensure the heatsink remains in constant contact with the chip, improving heat transfer. #### B. Material and Coating * **Aluminum 6063:** Chosen for its excellent balance between thermal conductivity and weight. * **Blue Anodization:** This is not just for aesthetics; the anodized layer provides corrosion resistance and increases surface emissivity, slightly improving radiative cooling. #### C. Thermal Interface Material (TIM) The "R0" designation typically implies the inclusion of a high-performance **Phase Change Material (PCM)** or thermal pad pre-applied to the base. This fills microscopic air gaps between the component and the heatsink. --- ### 3. Application Use Cases This specific heatsink size (35mm x 35mm) is standard for mid-sized electronic packages: 1. **Telecommunications:** Cooling Network Interface Cards (NICs) or small routers. 2. **Embedded Systems:** Industrial PCs where space is limited but airflow is present. 3. **Power Electronics:** Cooling Voltage Regulator Modules (VRMs). --- ### 4. Thermal Performance Overview The effectiveness of the ATS-01H-50-C2-R0 is highly dependent on airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural Convection) | 19.03 | | 300 | 7.10 | | 500 | 5.00 |