The **ATS-01H-52-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Dimensions** | 35mm x 35mm x 25mm | | **Thermal Resistance** | 10.79°C/W (Unducted Flow @ 100 LFM) | | **Flow Pattern** | Straight Fin | --- ### Key Electronic & Mechanical Features #### 1. Heat Dissipation Mechanism This part uses a **straight-fin** design. In electronics, this maximizes the surface area exposed to the surrounding air. As air moves through the fins (either via natural convection or a fan), heat is transferred from the base of the heat sink into the atmosphere. #### 2. Push-Pin Mounting System Unlike adhesive-based heat sinks, the "R0" designation indicates a **push-pin and spring** mounting mechanism: * **Reliability:** Provides consistent pressure (Pre-assembled with springs). * **Thermal Interface Material (TIM):** Usually comes pre-applied with a high-performance phase-change material to ensure no air gaps exist between the heat sink and the electronic chip. #### 3. Material Properties * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Provides corrosion resistance and improves emissivity, which slightly aids in radiative cooling. --- ### Usage in Circuits This component is typically found in: * **Embedded Systems:** Cooling microcontrollers or FPGAs. * **Power Supplies:** Dissipating heat from MOSFETs or Voltage Regulators. * **Telecommunications:** Cooling signal processing chips.