ATS-01H-60-C2-R0
AI

The **ATS-01H-60-C2-R0** is a high-performance electronic component specifically designed for **thermal management**. It is an aluminum heat sink manufactured by *Advanced Thermal Solutions (ATS)*, intended to dissipate heat from integrated circuits (ICs) and other electronic packages.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions** | 40.00mm x 40.00mm |
| **Height** | 25.00mm |
| **Thermal Resistance** | 6.06°C/W (at 200 LFM) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Fin Type** | Square Cross-Cut (Pin Fin) |
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### 2. Key Design Elements
#### A. Pin Fin Geometry
Unlike straight-fin heat sinks, the "Cross-Cut" or pin-fin design allows for **multi-directional airflow**. This is critical in cramped electronic enclosures where air may not flow in a single straight path. It increases the surface area for heat exchange and promotes turbulence, which improves cooling efficiency.
#### B. pushPIN™ Attachment
The "R0" suffix often refers to the specific attachment kit. This model uses a **pushPIN™ system**, which includes:
* **Compression Springs:** Ensure consistent pressure on the processor for maximum heat transfer.
* **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB.
#### C. Thermal Interface Material (TIM)
This specific part usually comes with **T766** pre-applied. This is a high-performance thermal grease or pad that fills microscopic air gaps between the electronic component (CPU/GPU) and the aluminum base of the heat sink.
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### 3. Application Use Cases
This component is typically used in the following electronic sectors:
1. **Telecommunications:** Cooling for high-speed routers and switches.
2. **Embedded Computing:** Cooling for ARM-based processors or FPGAs.
3. **Power Electronics:** Managing heat for DC-DC converters.
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### 4. Part Number Breakdown
`ATS - 01 H - 60 - C2 - R0`
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **01:** Series number.
* **H:** High-performance fin density.
* **60:** Specific dimension code.
* **C2:** Blue Anodized finish.
* **R0:** Revision/Attachment kit style.
- ⤷
How do I calculate if the 6.06°C/W thermal resistance is sufficient for my chip?
- ⤷ What are the advantages of blue anodized coating over bare aluminum?
- ⤷ Can this heat sink be mounted using thermal adhesive instead of push-pins?