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  • ATS-01H-66-C2-R0

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    The **ATS-01H-66-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from semiconductors and integrated circuits (ICs). --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-01H-66-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 11.96°C/W (Unducted Flow @ 200 LFM) | --- ## Key Components and Design ### 1. pushPIN™ Attachment Unlike standard adhesive-based heat sinks, this model uses a **pushPIN™** system. - It consists of a high-quality spring and a pin that passes through pre-drilled holes in the PCB. - This ensures a constant, high-pressure contact between the heat sink and the electronic component (CPU/GPU/FPGA), improving thermal transfer. ### 2. maxiFLOW™ Fin Geometry The fin design is the most critical "electronic part" of this assembly. - It uses a **tapered fin design** that increases the surface area while maintaining a low pressure drop. - The spread-fin orientation allows for multidirectional airflow, making it ideal for densely packed electronic enclosures. ### 3. Thermal Interface Material (TIM) The "C2" in the part number often indicates the type of thermal interface. This model typically comes with a pre-applied **Phase Change Material (PCM)** or high-performance thermal pad on the base. - **Function:** Fills microscopic air gaps between the chip and the aluminum base to minimize thermal impedance. --- ## Application in Electronics This part is typically used to cool high-heat generating components such as: * **FPGAs/ASICs:** High-speed logic chips that require stable operating temperatures. * **Processors:** Used in embedded systems where space is limited but cooling demands are high. * **Power Electronics:** Transistors or power modules in industrial controllers. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between pushPIN and adhesive mounting in heat sinks?
    • ⤷ How does 'Blue Anodized' finish affect the thermal performance of this part?
    • ⤷ What are the specific thermal resistance values at different airflow speeds (LFM)?