ATS-01H-66-C2-R0
AI

The **ATS-01H-66-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from semiconductors and integrated circuits (ICs).
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## Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Part Number** | ATS-01H-66-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 45mm x 45mm x 25mm |
| **Thermal Resistance** | 11.96°C/W (Unducted Flow @ 200 LFM) |
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## Key Components and Design
### 1. pushPIN™ Attachment
Unlike standard adhesive-based heat sinks, this model uses a **pushPIN™** system.
- It consists of a high-quality spring and a pin that passes through pre-drilled holes in the PCB.
- This ensures a constant, high-pressure contact between the heat sink and the electronic component (CPU/GPU/FPGA), improving thermal transfer.
### 2. maxiFLOW™ Fin Geometry
The fin design is the most critical "electronic part" of this assembly.
- It uses a **tapered fin design** that increases the surface area while maintaining a low pressure drop.
- The spread-fin orientation allows for multidirectional airflow, making it ideal for densely packed electronic enclosures.
### 3. Thermal Interface Material (TIM)
The "C2" in the part number often indicates the type of thermal interface. This model typically comes with a pre-applied **Phase Change Material (PCM)** or high-performance thermal pad on the base.
- **Function:** Fills microscopic air gaps between the chip and the aluminum base to minimize thermal impedance.
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## Application in Electronics
This part is typically used to cool high-heat generating components such as:
* **FPGAs/ASICs:** High-speed logic chips that require stable operating temperatures.
* **Processors:** Used in embedded systems where space is limited but cooling demands are high.
* **Power Electronics:** Transistors or power modules in industrial controllers.
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- ⤷
What is the difference between pushPIN and adhesive mounting in heat sinks?
- ⤷ How does 'Blue Anodized' finish affect the thermal performance of this part?
- ⤷ What are the specific thermal resistance values at different airflow speeds (LFM)?