The **ATS-01H-67-C2-R0** is not a complex electronic component like an integrated circuit, but rather a critical **thermal management component**—specifically a high-performance **Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to their **blueICE** series. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Spring Type** | Compression Spring (Stainless Steel) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Thermal Resistance (Flowing)** | 1.25 °C/W @ 200 LFM | | **Thermal Resistance (Static)** | 20.28 °C/W (Natural Convection) | | **Weight** | 35.00 grams | --- ### 2. Key Components & Design The "Electronic Part" functionality is defined by its mechanical assembly designed for PCB integration: * **Heat Sink Body:** Uses a cross-cut fin design to maximize surface area, allowing for multi-directional airflow. * **pushPIN™ Attachment:** This is the mounting mechanism. It uses a spring-loaded pin that snaps into pre-drilled holes on a Printed Circuit Board (PCB). * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a "Phase Change" or grease-like material that fills microscopic air gaps between the CPU/Chip and the heat sink. * **Compression Springs:** These provide precise, even pressure across the electronic component to ensure optimal heat transfer without cracking the silicon die. --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by ATS: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **01H** | pushPIN™ Series | | **67** | Specific physical dimensions/footprint | | **C2** | Thermal Performance Grade / Material | | **R0** | Revision code (standard) | --- ### 4. Applications This part is typically used to cool high-heat generating electronic components such as: * **FPGAs** (Field Programmable Gate Arrays) * **ASICs** (Application-Specific Integrated Circuits) * **Processors/CPUs** in embedded systems * **Northbridge/Southbridge** chips on motherboards