The **ATS-01H-68-C2-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its specifications and electronic application. --- ### 1. General Specifications This part is designed to dissipate heat from electronic components such as CPUs, GPUs, FPGAs, or power transistors. | Property | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01H-68-C2-R0 | | **Type** | Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits within the PCB layout constraints. | Dimension | Measurement | | :--- | :--- | | **Length** | 45.00 mm | | **Width** | 45.00 mm | | **Height (Fin Depth)** | 15.00 mm | | **Hole Spacing** | 38.00 mm | --- ### 3. Thermal Performance The efficiency of a heat sink is measured by its thermal resistance ($^\circ C/W$). Lower values indicate better cooling. * **Thermal Resistance (Natural Convection):** 15.31 °C/W * **Thermal Resistance (at 200 LFM):** 5.81 °C/W * **Thermal Resistance (at 500 LFM):** 2.83 °C/W --- ### 4. Key Electronic Features #### A. Pin Fin Design Unlike traditional straight-fin heat sinks, the pin-fin architecture allows for **omnidirectional airflow**. This is highly beneficial in electronics where the direction of the cooling fan's air might change or is turbulent. #### B. pushPIN™ Attachment This part utilizes a specific mechanical attachment system: * **Spring Mechanism:** Ensures constant pressure between the heat sink and the chip. * **Safety:** Prevents damage to the silicon die during installation. * **Reliability:** Highly resistant to shock and vibration compared to adhesive tapes. #### C. T766 Thermal Interface Material The part comes with **T766 TIM** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink, maximizing heat transfer. --- ### 5. Ideal Applications * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. * **Networking:** Routers and switches where vertical space is limited to 15mm. * **Embedded Systems:** Industrial PCs requiring rugged mechanical mounting.