ATS-01H-69-C2-R0
AI

### Technical Profile: ATS-01H-69-C2-R0
The **ATS-01H-69-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series designed to provide efficient thermal management for electronic components like CPUs, GPUs, and high-power transistors.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Type** | pushPIN™ |
| **Fin Type** | Straight |
| **Fin Pattern** | COARSE-PITCH |
| **Length (mm)** | 45.00 |
| **Width (mm)** | 45.00 |
| **Height (mm)** | 20.00 |
| **Pitch (mm)** | 1.15 |
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### 2. Thermal Performance Data
Thermal resistance is critical for preventing "thermal throttling" or component failure. Below is the performance based on airflow (Velocity):
| Air Velocity (LFM) | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) |
| :--- | :--- | :--- |
| 100 (0.5 m/s) | 11.51 °C/W | 1.90 °C/W |
| 200 (1.0 m/s) | 3.97 °C/W | 1.27 °C/W |
| 300 (1.5 m/s) | 2.57 °C/W | 1.05 °C/W |
| 500 (2.5 m/s) | 1.63 °C/W | 0.84 °C/W |
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### 3. Electronic Design Considerations
* **Attachment Mechanism:** It utilizes a pre-assembled **pushPIN™** system. This ensures consistent pressure across the interface, which is vital for maximizing thermal transfer from the electronic die to the sink.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T412**, a high-performance phase-change material that fills microscopic air gaps between the heat sink and the chip.
* **Mounting Holes:** Designed for a hole spacing of **38.00 mm x 38.00 mm**, making it compatible with standard PCB layouts.
* **EMI/RFI:** As an aluminum part, it provides incidental shielding but is primarily designed for heat dissipation rather than electromagnetic interference blocking.
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### 4. Typical Applications
1. **Embedded Systems:** Cooling Microprocessors (MCUs) or SoCs.
2. **Power Electronics:** Dissipating heat from MOSFETs and VRMs (Voltage Regulator Modules).
3. **Networking Hardware:** Cooling ASICs in switches and routers.
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What is the difference between ducted and unducted thermal resistance?
- ⤷ How does the T412 thermal interface material compare to standard thermal grease?
- ⤷ Can this heat sink be used on a PCB with a non-standard hole pitch?