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  • ATS-01H-69-C2-R0

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    ### Technical Profile: ATS-01H-69-C2-R0 The **ATS-01H-69-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series designed to provide efficient thermal management for electronic components like CPUs, GPUs, and high-power transistors. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | pushPIN™ | | **Fin Type** | Straight | | **Fin Pattern** | COARSE-PITCH | | **Length (mm)** | 45.00 | | **Width (mm)** | 45.00 | | **Height (mm)** | 20.00 | | **Pitch (mm)** | 1.15 | --- ### 2. Thermal Performance Data Thermal resistance is critical for preventing "thermal throttling" or component failure. Below is the performance based on airflow (Velocity): | Air Velocity (LFM) | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | | 100 (0.5 m/s) | 11.51 °C/W | 1.90 °C/W | | 200 (1.0 m/s) | 3.97 °C/W | 1.27 °C/W | | 300 (1.5 m/s) | 2.57 °C/W | 1.05 °C/W | | 500 (2.5 m/s) | 1.63 °C/W | 0.84 °C/W | --- ### 3. Electronic Design Considerations * **Attachment Mechanism:** It utilizes a pre-assembled **pushPIN™** system. This ensures consistent pressure across the interface, which is vital for maximizing thermal transfer from the electronic die to the sink. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412**, a high-performance phase-change material that fills microscopic air gaps between the heat sink and the chip. * **Mounting Holes:** Designed for a hole spacing of **38.00 mm x 38.00 mm**, making it compatible with standard PCB layouts. * **EMI/RFI:** As an aluminum part, it provides incidental shielding but is primarily designed for heat dissipation rather than electromagnetic interference blocking. --- ### 4. Typical Applications 1. **Embedded Systems:** Cooling Microprocessors (MCUs) or SoCs. 2. **Power Electronics:** Dissipating heat from MOSFETs and VRMs (Voltage Regulator Modules). 3. **Networking Hardware:** Cooling ASICs in switches and routers.
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted thermal resistance?
    • ⤷ How does the T412 thermal interface material compare to standard thermal grease?
    • ⤷ Can this heat sink be used on a PCB with a non-standard hole pitch?