The **ATS-01H-72-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the key mechanical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 35.00mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 5.19°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T412 (Phase change material) | --- ### 2. Physical Design Features The "72" in the part number identifies the specific fin geometry and height within the ATS catalog. * **Fin Type (Straight Fin):** This heat sink uses a straight fin design, which is ideal for systems with consistent, unidirectional airflow. * **Thermal Interface Material (TIM):** It comes pre-applied with **T412**, which fills microscopic air gaps between the component and the heat sink base to maximize heat transfer efficiency. * **Push-Pin Mounting:** This model uses a tool-free push-pin mechanism. This provides high assembly speed and consistent pressure (load) on the component, which is critical for long-term reliability. --- ### 3. Thermal Performance Breakdown The efficiency of the ATS-01H-72-C3-R0 depends heavily on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 5.19 | | **300 (1.5 m/s)** | 1.45 | | **500 (2.5 m/s)** | 1.05 | | **700 (3.5 m/s)** | 0.84 | *Note: Lower °C/W values indicate better cooling performance.* --- ### 4. Application Context This part is commonly found in: * **Networking Equipment:** Routers and switches where high-profile cooling is required. * **Industrial PCs:** Providing cooling for embedded processors. * **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power supply units.