The **ATS-01H-82-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties: | Parameter | Specification | | :--- | :--- | | **Type** | Board Level Heat Sink | | **Material** | Aluminum (with Blue Anodized Finish) | | **Shape** | Square Pin Fin | | **Dimensions** | 30.00mm x 30.00mm x 25.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | ~10.79°C/W (at 100 LFM) | | **Weight** | ~40 grams | --- ### 2. Key Components & Features #### A. Pin Fin Design Unlike traditional straight-fin heat sinks, the **Pin Fin** geometry (a grid of vertical pegs) allows for multi-directional airflow. This makes it highly efficient in "crowded" PCB environments where airflow direction might be inconsistent. #### B. pushPIN™ Attachment This model uses the proprietary ATS **pushPIN™** system. It consists of: * **Compression Springs:** Provides precise pressure (Force) to ensure optimal contact with the heat source. * **Nylon/Plastic Push Pins:** Allows for secure mounting through pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number usually signifies the inclusion of a pre-applied **Thermal Interface Material** (typically a high-performance phase-change material or thermal pad). This eliminates the need for manual application of thermal paste. --- ### 3. Thermal Performance Analysis The efficiency of this part is highly dependent on the velocity of the air moving through the pins (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (100 LFM)** | 10.79 | | **Unducted (300 LFM)** | 3.90 | | **Unducted (500 LFM)** | 2.50 | --- ### 4. Typical Applications * **Embedded Systems:** For cooling high-speed microprocessors. * **Power Supplies:** Managing heat in voltage regulators. * **Telecommunications:** Cooling chips in routers and switches. * **LED Systems:** Dissipating heat from high-output LED arrays.