Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-01H-93-C2-R0

  • AI
    The **ATS-01H-93-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin pattern, and thermal resistance. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS Assembly | | **Attachment Type** | Push-Pin | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Fin Style** | Straight (Vertical) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Features * **Push-Pin Mounting:** This part uses a specialized push-pin mechanism with a high-tension spring. This ensures a constant, repeatable pressure on the electronic component, which optimizes the heat transfer through the Thermal Interface Material (TIM). * **Thermal Resistance:** It is designed to work under forced convection (airflow). At specific airflow rates (LFM - Linear Feet per Minute), it reduces the temperature gradient between the component junction and the ambient air. * **Material Properties:** Made from lightweight aluminum, providing a balance between thermal conductivity and cost-effectiveness. The "Blue Anodized" coating prevents corrosion and provides a slight increase in surface emissivity. --- ### 3. Electronic Application The **ATS-01H-93-C2-R0** is typically found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed ASICs in network switches. 2. **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power supply units. 3. **Embedded Systems:** Used on small form-factor motherboards where vertical space (20mm) is available but airflow is managed. --- ### 4. Part Number Breakdown ```text ATS - 01 H - 93 - C2 - R0 | | | | | | | | | +-- Revision/Internal Code | | | +------- Finish (C2 = Blue Anodized) | | +------------ Series/Fin Pattern | +----------------- Height (H = High Profile) +----------------------- Brand (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What is the exact thermal resistance of this heat sink at 200 LFM?
    • ⤷ What are the compatible PCB hole diameters for the push-pin mounting?
    • ⤷ How does the T766 interface material compare to standard thermal paste?