ATS-01H-93-C2-R0
AI

The **ATS-01H-93-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS to define the dimensions, fin pattern, and thermal resistance.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ HS Assembly |
| **Attachment Type** | Push-Pin |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm |
| **Fin Style** | Straight (Vertical) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
---
### 2. Key Design Features
* **Push-Pin Mounting:** This part uses a specialized push-pin mechanism with a high-tension spring. This ensures a constant, repeatable pressure on the electronic component, which optimizes the heat transfer through the Thermal Interface Material (TIM).
* **Thermal Resistance:** It is designed to work under forced convection (airflow). At specific airflow rates (LFM - Linear Feet per Minute), it reduces the temperature gradient between the component junction and the ambient air.
* **Material Properties:** Made from lightweight aluminum, providing a balance between thermal conductivity and cost-effectiveness. The "Blue Anodized" coating prevents corrosion and provides a slight increase in surface emissivity.
---
### 3. Electronic Application
The **ATS-01H-93-C2-R0** is typically found in the following electronic environments:
1. **Telecommunications:** Cooling of high-speed ASICs in network switches.
2. **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power supply units.
3. **Embedded Systems:** Used on small form-factor motherboards where vertical space (20mm) is available but airflow is managed.
---
### 4. Part Number Breakdown
```text
ATS - 01 H - 93 - C2 - R0
| | | | |
| | | | +-- Revision/Internal Code
| | | +------- Finish (C2 = Blue Anodized)
| | +------------ Series/Fin Pattern
| +----------------- Height (H = High Profile)
+----------------------- Brand (Advanced Thermal Solutions)
```
- ⤷
What is the exact thermal resistance of this heat sink at 200 LFM?
- ⤷ What are the compatible PCB hole diameters for the push-pin mounting?
- ⤷ How does the T766 interface material compare to standard thermal paste?