The **ATS-01H-94-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by *Advanced Thermal Solutions (ATS)*. It is part of the "blue ice" series, designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this specific part number: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm x 25mm | | **Attachment Method** | push-PIN™ | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 4.49°C/W (at 200 LFM) | | **Base Shape** | Square | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Design Features * **Heat Sink Material:** Made of aluminum, which provides a high thermal conductivity-to-weight ratio. The blue anodized finish improves surface emissivity and protects against corrosion. * **push-PIN™ Attachment:** This model uses a standard push-pin mechanism with a flexible spring. This ensures consistent pressure on the component (IC) for optimal heat transfer without over-stressing the PCB. * **Straight Fin Geometry:** The straight fins are designed for maximum airflow efficiency in a specific direction. They are most effective when the airflow is parallel to the fins. * **Thermal Interface Material (TIM):** It comes pre-applied with T766, which eliminates the need for manual application of thermal paste during assembly, ensuring a uniform layer and reliable thermal contact. --- ### 3. Electronic Application Use Cases The ATS-01H-94-C2-R0 is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Industrial Automation:** Thermal management for power modules. 3. **Computing:** Chipset cooling for servers or embedded systems. ---