The **ATS-01H-96-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "blue ice" push-pin series designed for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | Push-Pin (with 2 attachment holes) | | **Dimensions (L x W x H)** | 40mm x 40mm x 35mm | | **Fin Style** | Straight | | **Thermal Resistance** | ~5.63°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Fin Design The "Straight" fin pattern is optimized for **forced air cooling**. Because the fins are 35mm high, it provides a large surface area for heat dissipation compared to low-profile alternatives. #### B. Attachment System (Push-Pins) The device uses a brass or plastic push-pin system with a stainless steel spring. * **Benefits:** Ensures constant pressure on the electronic chip, which improves heat transfer through the Thermal Interface Material (TIM). * **Installation:** Requires pre-drilled holes in the PCB (Printed Circuit Board). #### C. Thermal Interface Material (T766) The "C2" in the part number indicates it comes with **T766** phase-change material pre-applied to the base. * **Function:** This fills microscopic air gaps between the heat sink base and the electronic component, significantly reducing thermal resistance. --- ### 3. Application Use Cases This specific heat sink is typically used for cooling: 1. **High-Speed Processors:** Small form factor CPUs. 2. **ASICs/FPGAs:** Custom integrated circuits that generate significant localized heat. 3. **Power Electronics:** Large transistors or voltage regulators that require vertical airflow. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as airflow (Measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 5.63 | | 200 (Medium) | 1.81 | | 400 (High) | 1.15 |