The **ATS-02A-100-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their **maxiFLOW™** series, specifically designed for cooling electronic components such as CPUs, GPUs, FPGAs, and high-power transistors. --- ## 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing Air)** | ~2.10 °C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | ~4.70 °C/W | --- ## 2. Key Electronic & Mechanical Features ### A. maxiFLOW™ Fin Geometry The "Electronic Part" design of this heat sink utilizes a graduated fin pattern. Unlike standard square fins, these are tapered to maximize the surface area for heat dissipation while minimizing the pressure drop. This is critical for electronic systems where airflow is restricted by other components. ### B. pushPIN™ Attachment System The part uses a **pushPIN™** assembly, which consists of: * **Compression Springs:** Ensures consistent pressure (clamping force) across the thermal interface material (TIM). * **Plastic/Brass Pins:** Secure the heat sink directly to pre-drilled holes in the PCB. * **Reliability:** Prevents the heat sink from shifting during mechanical shock or vibration, which protects the delicate solder balls of BGA packages. ### C. Thermal Interface Material (TIM) The **-R0** suffix indicates the specific revision and typically includes a pre-applied high-performance thermal phase-change material or tape (usually **Chomerics T766**). This ensures that microscopic air gaps between the electronic chip and the heat sink are filled for maximum heat transfer. --- ## 3. Application Use Cases This component is typically found in: * **Telecommunications:** Networking switches and routers. * **Industrial PC (IPC):** Embedded systems requiring high reliability. * **Power Electronics:** Cooling MOSFET arrays or voltage regulators.